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Showing results 1 to 3 of 3

Issue DateTitleAuthor(s)
-A low temperature direct bonding method using an electron-beam evaporated silicon-oxide interlayerJu Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; H. W. Park; J. H. Park; N. Y. Lee; K. H. Koh; D. K. Shin; I. B. Kang; N. Samaan; M. R. Haskard
-A study on hermetic glass sealing using a modified direct bonding methodJu Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; C. G. Ko; I. B. Kang; P. White; N. Samaan; M. R. Haskard
-An assembly and interconnection technology for micromechanical structure using a anisotropic conductive filmI. B. Kang; Ju Byeong Kwon; M. R. Haskard
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