| 2014-01 | Arc plasma deposition of Pd seeding for Cu electroless deposition | Hwang, Juyeon; Yoon, Woo Young; Byun, Ji Young; Kim, Sang Hoon |
| 2006-12 | Cationic Surfactants for the control of overfill bumps in Cu superfilling | Kim, S. -K.; Josell, D.; Moffat, T. P. |
| - | Corrosion properties of Cu-containing heat resistant austenitic steel | Hong Sung Min; Kwon, Oh Jib; Eric Fleury |
| - | Design and fabrication of fatigue damage free metal electrode with 2D nanohole arrays | Choi In Suk; Kim Byoung-Joon; Joo Young-chang |
| 2012-05-07 | Dimethyl ether (DME) reforming by microreactor using Cu and Cr as active components over gamma alumina | Kousar, Rehana; Kim, Do Hyung; Yu, Byung-Yong; Ha, Heon Phil; Kim, Sang Hoon; Byun, Ji Young |
| - | Effect of Cu/perovskite anode for simultaneous reaction in SOFC reactor | 이현철; 김준호; 성대진; Moon Dong Ju; 홍석인 |
| 2017-06 | Enhanced thermal conductivity of epoxy/Cu-plated carbon fiber fabric composites | Yu, Seunggun; Park, Kyusup; Lee, Jang-Woo; Hong, Soon Man; Park, Cheolmin; Han, Tae Hee; Koo, Chong Min |
| - | Fabrication of the electrodes of gas sensor based on nano-copper particles by ink-jet printing | Kim Se Hoon; Wang Byung-yong; Oh, Young-Jei |
| - | Investigation into the Cu addition effect in the 23Cr ferritic stainless steel for SOFC interconnect | Kim Byung Kyu; Kim, Dong-Ik; SHIM, JAE-HYEOK; Jung, Woo Sang; Kyung-Woo Yi; Sook In Kwun |
| - | Investigation into the Recrystallization Phenomena of Cu Damascene Line | Kim Dong-Ik; Hyo-Jong Lee; Kyu Hwan Oh; Hu-Chul Lee |
| 2013-10 | Investigation of Tungsten Nitride Deposition Using Tungsten Hexafluoride Precursor for Via and Plug Metallization | Hwang, Yeong-Hyeon; Cho, Won-Ju; Kim, Yongtae |
| 1998-03 | Low-energy ion beam and its applications | 최성창; 정형진; 고석근 |
| 2023-06 | Magnetically Driven Powerless Lighting Device with Kirigami Structured Magneto-Mechanoluminescence Composite | Listyawan, Michael Abraham; Song, Hyunseok; Jung, Ji Yun; Shin, Joonchul; Hwang, Geon-Tae; Song, Hyun-Cheol; Ryu, Jungho |
| 2007-10 | Molecular dynamics simulation of screw dislocation interaction with stacking fault tetrahedron in face-centered cubic Cu | Lee, Hyon-Jee; Shim, Jae-Hyeok; Wirth, Brian D. |
| 2018-04 | Performance of WCN diffusion barrier for Cu multilevel interconnects | Lee, Seung Yeon; Ju, Byeong-Kwon; Kim, Yong Tae |
| - | Reactive polymer membranes containing cuprous complexes in olefin/paraffin separation | Kim Yong Jin; Kim. Hoon Sik; 김영희; Kang Yong Soo; 진종식 |
| 2013-02-01 | Removal characteristics of copper by marine macro-algae-derived chars | Cho, Hye Jung; Baek, Kitae; Jeon, Jong-Ki; Park, Sung Hoon; Suh, Dong Jin; Park, Young-Kwon |
| 2011-02 | Studies on Nanosized Iron Based Modified Catalyst for Fischer-Tropsch Synthesis Application | Park, MoonJu; Kang, Jung Shik; Na, Ki Poong; Lee, Sang Deuk; Awate, S. V.; Moon, Dong Ju |
| - | The role of ZnO on the activity of Cu/ZnO/Al2O3 catalysts for hydrogenolysis of butyl butyrate | Kim Sung Min; Lee Mi Eun; CHOI, JAE WOOK; Suh, Dong Jin; Suh Young-Woong |
| 1988-01 | Threshold stress for cyclic creep acceleration in copper. | 홍경태; 이재곤; 남수우 |
| 2008-01 | Two-step filling in Cu electroless deposition using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid | Lee, Chang Hwa; Kim, Ae Rim; Kim, Soo-Kil; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong |
| - | (Undefined) | 진성언; 변동진; 이승무; Ji Hun Park; 이도한; 최종문; 김창균; 정택모 |
| - | (Undefined) | 이현철; 성대진; 김준호; Moon, Dong Ju; 홍석인 |
