Showing results 1 to 1 of 1
Issue Date | Title | Author(s) |
---|---|---|
2001-03 | Improvement of the reliability of a Cu/W-N/SiOF multilevel interconnect by inserting plasma enhanced chemical vapor deposited W-N thin film | Kim, DJ; Sim, HS; Lee, S; Kim, YT; Kim, SI; Park, JW |