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Showing results 27 to 53 of 53

Issue DateTitleAuthor(s)
1999-09Si-to-Si electrostatic bonding using LSG film as an interlayer주병권; 정지원; 이덕중; 이윤희; 최두진; 오명환
1999-09Sodalime-sodalime electrostatic bonding using amorphous silicon interlayer and its application to FEA packaging주병권; 이덕중; 최우범; 김영조; 이남양; 오명환
-Study on glass-to-silicon anodic bonding using hydrophilic processJu Byeong Kwon; 이덕중; 장진; OH MYUNG HWAN
-Study on tubeless packaging of plasma display panel정진욱; 김영조; 이덕중; 최은하; 문권진; 김준동; Ju Byeong Kwon
-Study on vacuum packaging of field emission display이덕중; Ju Byeong Kwon; 장진; OH MYUNG HWAN
-Surface-micromachined vacuum magnetic field sensorsJu Byeong Kwon; 박흥우; 이덕중; PARK JEONG HO; OH MYUNG HWAN
-Technical improvement of FED tubeless packagingJu Byeong Kwon; 이덕중; 최우범; 정성재; LEE NAM YANG; 조경익; LEE YUN HI; 성만영; OH MYUNG HWAN
1999-12Technical improvement of FED tubeless packaging주병권; 이덕중
-Thin PDP packaging by glass-bonding techonlogy and its driving properties이덕중; Ju Byeong Kwon; 정진욱; 박흥우; LEE YUN HI; 김영조; 조태성; 최은하; 장진; OH MYUNG HWAN
-Thin PDP packaging technology in low temperature and emission characteristicsJu Byeong Kwon; 이덕중; 정진욱; 김영조; 최은하; 장진; OH MYUNG HWAN
-Tubeless packaging of field emission display using glass to glass electrostatic bonding technology정지원; Ju Byeong Kwon; 이덕중; LEE YUN HI; N. Y. Lee; Y. W. Ko; Y. G. Moon; CHOI DOO JIN; OH MYUNG HWAN
-Vacuum in-line PDP sealing in low temperature by organic materials이덕중; 문권진; 김준동; 송치호; 장진; OH MYUNG HWAN; Ju Byeong Kwon
-Vacuum packaging and operating properties of micro-tunneling sensorsJu Byeong Kwon; 박흥우; 이덕중; SON YONG BAE; PARK JEONG HO; OH MYUNG HWAN
-Vacuum packaging of field emitter array using electrostatically-bonded glass-Si-glass/glass-glass structureJu Byeong Kwon; 이덕중; 정지원; Kim Hun; 이상조; LEE NAM YANG; 장진; OH MYUNG HWAN
-Vacuum sealing of field-emission arrays using field-assisted bonding method이덕중; Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; LEE NAM YANG; 한정인; 조경익; 장진
2000-04Vacuum-electrostatic bonding properties of glass-to-glass substrates주병권; 이덕중; 이윤희
-Wafer level sealing technology of MEMS devices using B-stage epoxy박흥우; 박윤권; 이덕중; 김철주; PARK JEONG HO; 서용교; 김정우; SONG CI MOO; OH MYUNG HWAN; Ju Byeong Kwon
2002-08디스플레이용 소재 기술김훈; 이주원; 장재원; 이덕중; 주병권
2000-08-03반도체기판의　정전　열　접합　방법주병권; 오명환; 최우범; 이덕중
2002-10-01정전열전합을　이용한　진공실장방법주병권; 이덕중; 오명환; 이윤희
2004-09-14탄소나노튜브를 이용한 3극구조를 가지는 평판형전계방출램프 및 그 제조방법주병권; 서상희; 이덕중; 김광윤; 이윤희; 유재은
-(Undefined)Ju Byeong Kwon; 박흥우; 이덕중; 서상원; 김남수; PARK JEONG HO; OH MYUNG HWAN
-(Undefined)Ju Byeong Kwon; 박흥우; 이덕중; PARK JEONG HO; OH MYUNG HWAN
-(Undefined)이덕중; Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; 장진
-(Undefined)이덕중; Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; 장진
-(Undefined)강문식; Ju Byeong Kwon; 장윤택; 이덕중; LEE YUN HI; 이내성; KIM JONG MIN; 유건호; OH MYUNG HWAN
-(Undefined)정지원; Ju Byeong Kwon; 최우범; 이덕중; CHOI DOO JIN; OH MYUNG HWAN
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