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Showing results 1 to 30 of 42

Issue DateTitleAuthor(s)
-3D 패키징 적용을 위한 박막 실리콘 기판을 이용한 RF-MEMS 패키징 .김용국; 박윤진; 김철주; Ju Byeong Kwon
-A novel wafer level packaging of the RF-MEMS devices with low loss박윤권; 이덕중; 박흥우; 송인상; 김정우; SONG CI MOO; LEE YUN HI; 김철주; Ju Byeong Kwon
2000-10A study on Fabrication of Thermopile Infrared Detector이성준; 주병권; 이윤희; 서상희; 오영제; 김태윤; 김철주
-Characteristic estimation of the formation and etching of PZT thin films for pyroelectric IR sensor application박윤권; Ju Byeong Kwon; 전호승; Yoon Young Soo; Oh Young-Jei; LEE YUN HI; SUH SANG HEE; OH MYUNG HWAN; 김철주
-DLC-coated knife-edge field emitter arrays on (110) Si waferJu Byeong Kwon; OH MYUNG HWAN; 고창기; Jung Jae Hoon; 김철주
-Effect of wet-etching process on the gate insulator of metal tip FEA정유호; Ju Byeong Kwon; Jung Jae Hoon; LEE YUN HI; OH MYUNG HWAN; 김철주
-Elimination of hole traps on Si wafer using reoxidation method홍순관; Ju Byeong Kwon; 김철주
-Etching-bonding-thin film deposition process for MEMS-IR SENSOR application박윤권; Ju Byeong Kwon; 박흥우; PARK JEONG HO; Sang-Seop Yom; SUH SANG HEE; OH MYUNG HWAN; 김철주
1994-02Fabrication and characterization of silicon devices for flow measurement (II)주병권; 고창기; 김철주; 차균현; 오명환
-Fabrication and characterization of silicon field emission device고창기; Jung Jae Hoon; Ju Byeong Kwon; 장진; 김철주; OH, MYUNG HWAN
2001-09Fabrication and packaging of the vacuum magnetic field sensor박흥우; 박윤권; 이덕중; 김철주; 박정호; 오명환; 주병권
1997-06Fabrication and performance improvement of silicon cold electron source having a whisker-shapped cross-sectional structure주병권; 고창기; 이윤희; 정재훈; 이병호; 김철주; 오명환
-Fabrication of (100), (110), (111) Si tip using various wet etching method박흥우; Ju Byeong Kwon; KO CHANG GI; 홍순관; OH MYUNG HWAN; 김철주
-Fabrication of knife type Si tip array by orientatio dependent etching of single silicon substrate정유호; 고창기; 김철주; Ju Byeong Kwon; OH MYUNG HWAN
-Fabrication of piezoresistive pressure sensor and its application to digital pressure guage하병주; Ju Byeong Kwon; 박선우; 차균현; OH MYUNG HWAN; 김철주
-Fabrication of Si tips for field emission devicesJu Byeong Kwon; OH MYUNG HWAN; 박흥우; 하병주; 박재홍; 김철주
-Fabrication of un-cooled infrared sensor using pyroelectric thin film박윤권; Ju Byeong Kwon; 박흥우; Yoon Young Soo; Sang-Seop Yom; Oh Young-Jei; PARK JEONG HO; SUH SANG HEE; OH MYUNG HWAN; 김철주
1991-08Filling-up effect of micro-gap by interfacial oxide growing in SFB process강광남; 주병권; 이재옥; 김철주; 오명환; 차균현; 이명복
1994-10Formation of silicon diaphragm using silicon-wafer direct bonding / electrochemical etch-stopping and its application to silicon pressure sensor fabrication주병권; 하병주; 김근섭; 송만호; 김성환; 김철주; 차균현; 오명환
-MEMS-IR sensor fabrication and characterizationJu Byeong Kwon; 박흥우; 박윤권; PARK JEONG HO; 김철주; Sang-Seop Yom; SUH SANG HEE; OH MYUNG HWAN
-Micro-tunneling sensor for vacuum level evaluation of field emission display박흥우; Ju Byeong Kwon; 박윤권; 김철주; OH MYUNG HWAN
-Micro-tunneling sensors for vacuum level evaluation of field emission display devices박흥우; Ju Byeong Kwon; 박윤권; 김철주; OH MYUNG HWAN
1992-01Microscopy study for the batch fabrication of silicon diaphragm하병주; 주병권; 차균현; 오명환; 김철주
-Packaging of the MEMS devices using thin silicon wafer박윤권; 김용국; Kim Hun; LEE YUN HI; 김철주; Ju Byeong Kwon
-Packaging of the RF-MEMS switch박흥우; 이덕중; 박윤권; 김철주; PARK JEONG HO; 서용교; 김정우; SONG CI MOO; OH MYUNG HWAN; Ju Byeong Kwon
1992-01Short consideration on the non-uniformities existing at the etched-edges in deep anisotropic etching of (100) silicon주병권; 하병주; 김철주; 오명환; 차균현
-Si micromachining for MEMS-IR sensor application박흥우; Ju Byeong Kwon; 박윤권; PARK JEONG HO; 김철주; Sang-Seop Yom; SUH SANG HEE; OH MYUNG HWAN
1998-10Si micromachining for MEMS-IR sensor application박흥우; 주병권; 박윤권; 박정호; 김철주; 염상섭; 서상희; 오명환
2001-11Studies on Formation of the Floating Membrane using SOI Wafer and Application to Fabrication of Thermopile Sensor이성준; 주병권; 이윤희; 서상희; 오명환; 김태윤; 김철주
-Study on the batch fabrication of silicon diaphragms하병주; Ju Byeong Kwon; 차균현; OH MYUNG HWAN; 김철주

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