Showing results 1 to 2 of 2
Issue Date | Title | Author(s) |
---|---|---|
1996-07 | Anodic bonding technique under low-temperature and low-voltage using evaporated glass | Choi, Woo-Beom; Ju, Byeong-Kwon; Jeong, Seong-jae; Lee, Nam-Yang; Koh, Ken-Ha; Haskard, M.R.; Sung, Man-Young; Oh, Myung-Hwan |
1997-08 | New packaging method of field emission display using silicon-to-ITO coated glass bonding | Jeong, Jee-Won; Ju, Byeong-Kwon; Choi, Woo-Beom; Lee, Duck-Jung; Lee, Yun-Hi; Lee, Nam-Yang; Jung, Seong-Jae; Choi, Doo-Jin; Oh, Myung-Hwan |