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Showing results 1 to 4 of 4

Issue DateTitleAuthor(s)
2013-05Crack nucleation during mechanical fatigue in thin metal films on flexible substratesKim, Byoung-Joon; Shin, Hae-A-Seul; Jung, Sung-Yup; Cho, Yigil; Kraft, Oliver; Choi, In-Suk; Joo, Young-Chang
2014-12-14Effect of film thickness on the stretchability and fatigue resistance of Cu films on polymer substratesKim, Byoung-Joon; Shin, Hae-A-Seul; Lee, Ji-Hoon; Yang, Tae-Youl; Haas, Thomas; Gruber, Patric; Choi, In-Suk; Kraft, Oliver; Joo, Young-Chang
2012-11-05Fatigue-Free, Electrically Reliable Copper Electrode with Nanohole ArrayKim, Byoung-Joon; Cho, Yigil; Jung, Min-Suk; Shin, Hae-A-Seul; Moon, Myoung-Woon; Han, Heung Nam; Nam, Ki Tae; Joo, Young-Chang; Choi, In-Suk
2012-04Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal AnnealingShin, Hae-A-Seul; Kim, Byoung-Joon; Kim, Ju-Heon; Hwang, Sung-Hwan; Budiman, Arief Suriadi; Son, Ho-Young; Byun, Kwang-Yoo; Tamura, Nobumichi; Kunz, Martin; Kim, Dong-Ik; Joo, Young-Chang
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