Kim, Yong Tae Lee Eui-Bok Kim, Young-Hwan KIM, CHUN KEUN Byeong Kwon 2024-01-13T00:06:23Z 2024-01-13T00:06:23Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/100193 English ALD Diffusion barrier Cu interconnects Electromigration Electrical Characteristics of Atomic Layer Deposited Tungsten Nitride Diffusion Barrier for Cu Interconnects Conference 1 2010 Asia-Pacific Workshop on fundamentals and Applications of Advanced Semiconductor Devices, v.110, no.110, pp.61 - 63 2010 Asia-Pacific Workshop on fundamentals and Applications of Advanced Semiconductor Devices 110 110 61 63 JA