HAN, JUN HYUN Kim Jae Hyun Myoung-Woon Moon HAN, SEUNG HEE Joost J. Vlassak 2024-01-13T04:31:21Z 2024-01-13T04:31:21Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/102514 English silicon wafer chemical etching surface instability KOH roughness Surface instability caused by stress during chemical etching of silicon wafer Conference 1 First International Coference on Microelectronics and Plasma Techology First International Coference on Microelectronics and Plasma Techology KO