Park, In Seon Lee, Sang In Wee Young Jin Jung, Woo Sang Choi, Gil Hyeon Park, Chang Soo Park, Seon Hoo Ahn, Sung Tae Lee, Moon Yong Y.K. Kim R. Reynolds 2024-01-13T05:00:50Z 2024-01-13T05:00:50Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/102744 English Al-Reflow ECR Plasma Treatment Contact filling 256Mbit DRAM A Novel Al-Reflow Process Using Surface Modification by the ECR Plasma Treatment and Its Application to the 256Mbit DRAM Conference 1 Electron Devices Meeting, 1994, Technical Digest., International, pp.109 - 112 Electron Devices Meeting, 1994, Technical Digest., International 109 112 US