Hong Ju Hi HAN, SEUNG HEE LEE, YEON HEE Kang-Jin Kim 2024-01-13T08:02:55Z 2024-01-13T08:02:55Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/104491 English adhesion PSII Copper polyimide Enhancement of adhesion strength between Cu and PoIyimide by PSII treatment Conference 2 제 94회 대한화학회, v.94, pp.141 제 94회 대한화학회 94 141 141 KO