Chang Woo Lee Kim, Yong Tae Park Ji Ho Hee Joon Kim 2024-01-13T08:33:05Z 2024-01-13T08:33:05Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/104765 English W-C-N diffusion barrier Characteristics of W-C-N thin film as a new diffusion barrier for Cu interconnection Conference 1 2005 Korea-Japan joint workshop on advanced semiconductor processes and equipments 2005 Korea-Japan joint workshop on advanced semiconductor processes and equipments KO