Chang Woo Lee Kim, Yong Tae 2024-01-13T08:33:12Z 2024-01-13T08:33:12Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/104772 English pulse plasma WN Characteristics of Cu/PPALD (pulse-plasma atomic layer deposited) WN/methyl silsequioxane/Si for multi-level Cu interconnection Conference 1 The international conference on electrical engineering 2005 (ICEE2005) The international conference on electrical engineering 2005 (ICEE2005) CC