PARK JONG KUK Byun, Young Tae Kim, Sun Ho Jin Woo Park 2024-01-13T09:01:42Z 2024-01-13T09:01:42Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/104937 English Direct wafer bonding Hybrid device GaAs/SiO2/Si bonding Smart-cut process PECVD Direct wafer bonding of GaAs/SiO2/Si for hybrid semiconductor optical devices Conference 1 The 10th Optoelectronics and Communications Conference(OECC 2005), pp.670 - 671 The 10th Optoelectronics and Communications Conference(OECC 2005) 670 671 KO