Jin Hyun JEON BUP JU Dongjin Byun Lee, Joong Kee 2024-01-13T11:02:33Z 2024-01-13T11:02:33Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/106055 English Cu film ECR-MOCVD DC bias polymer substrate Effects of process parameters on the adhesion of copper film on polyethylene tetrephthalate(PET) substrate prepared by ECRMOCVD coupled with a periodic DC bias Conference 1 Mat. Res. Soc. Symp. Proc., v.795, pp.851 - 856 Mat. Res. Soc. Symp. Proc. 795 851 856 US