심현상 Kim Yong Tae 전형탁 2024-01-13T12:30:45Z 2024-01-13T12:30:45Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/106737 English 펄스플라즈마 원자층증착 cu-interconnect diffusion barrier기술 Characteristics of pulse plasma enhanced atomic layer deposition of tungsten nitride diffusion barrier for copper interconnect Conference 2 AVS Topical Conference on Atomic Layer Deposition, pp.67 AVS Topical Conference on Atomic Layer Deposition 67 67 KO