박윤권 김용국 Kim Hun LEE YUN HI 김철주 Ju Byeong Kwon 2024-01-13T13:02:58Z 2024-01-13T13:02:58Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/107144 English Thin 웨이퍼 패키징 FBAR Packaging of the MEMS devices using thin silicon wafer Thin 실리콘 기판을 이용한 MEMS 소자의 패키징 Conference 2 SENSORS CONFERENCE 2002, pp.320 - 323 SENSORS CONFERENCE 2002 320 323 KO