차국헌 주상현 김수한 심현상 Kim Yong Tae 한진희 이진규 윤도영 2024-01-13T14:02:10Z 2024-01-13T14:02:10Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/107632 English low-k MSQ interconnection Structural and micromechanical characteristics of low-dielectric organosilicate thin films modified by NH₃ plasma treatment Conference 2 The Second Asian Conference on Chemical Vapor Deposition, pp.48 - 51 The Second Asian Conference on Chemical Vapor Deposition 48 51 KO