심현상 Kim Yong Tae 김동준 전형탁 추상현 차국현 2024-01-13T14:30:36Z 2024-01-13T14:30:36Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/107795 English low-k A method of improving dielectric constant and adhesion strength of methysilsesquioxyane by using a NH3 plasma treatment Conference 1 Material Research Society (MRS) 2001 spring Meeting, pp.231. Material Research Society (MRS) 2001 spring Meeting 231. 231. US