Kim Yong Tae 2024-01-13T14:33:10Z 2024-01-13T14:33:10Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/107957 English LOW-K MSQ inter-level dielectirc재료 다층배선 초고집적소자 A method of improving dielectric constant and adhesion strength of methyl silsesquioxane by using a NH3 plasma treatment Conference 2 Proceedings of the 3rd International Symposium on Electronic Materials and Packaging 2001, pp.Session C-2 Proceedings of the 3rd International Symposium on Electronic Materials and Packaging 2001 Session C-2 KO