이유용 PARK YOUNG JOON Cho Byung Won 이재봉 2024-01-13T15:00:42Z 2024-01-13T15:00:42Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/108061 English Cu interconnects superfilling electroplating Effects of current wave forms and current densities on the electroplated Cu interconnection in damascene plating Conference 2 Proceedings of the 12th Asia Pacific Corrosion Control Conference, pp.122 - 132 Proceedings of the 12th Asia Pacific Corrosion Control Conference 122 132 KO