백진욱 Kim Seo Young 강병하 2024-01-13T16:04:23Z 2024-01-13T16:04:23Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/108828 English aluminum foam Heat transfer from an aluminum foam heat sink for electronics cooling Conference 1 Proceedings of the 4th JSME-KSME Thermal Engineering Conference, pp.2 - 635-2-640 Proceedings of the 4th JSME-KSME Thermal Engineering Conference 2 635-2-640 JA