D. J. Lee Ju Byeong Kwon OH MYUNG HWAN LEE NAM YANG 정성재 김관수 한정인 J. Jang 2024-01-13T17:02:27Z 2024-01-13T17:02:27Z 2021-09-29 0099-0966 https://pubs.kist.re.kr/handle/201004/109242 English FED FEA MEMS Characterization of tubeless packaged FED by glass-to-glass anodic bonding method Conference 1 SID 99 Digest, pp.580 - 583 SID 99 Digest 580 583 US