V. K. Andleigh PARK YOUNG JOON C. V. Thompson 2024-01-13T17:32:17Z 2024-01-13T17:32:17Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/109499 English electromigration reliability Interconnect failure mechanism maps for different metallization materials and processes Conference 1 Materials Reliability in Microelectronics IX (Mat. Res. Soc. Symp. Proc. v.563), v.563, pp.59 - 64 Materials Reliability in Microelectronics IX (Mat. Res. Soc. Symp. Proc. v.563) 563 59 64 US