Kim Yong Tae 김동준 이석형 PARK YOUNG KYUN 김익수 박종완 2024-01-13T18:03:30Z 2024-01-13T18:03:30Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/109837 English PECVD SiOF W-N diffusion barrier Effects PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnect Conference 1 Proc. of EOS/SPIE Symposium on Microelectronic Manufacturing Technologies Proc. of EOS/SPIE Symposium on Microelectronic Manufacturing Technologies UK