Vaibhav K. Andleigh PARK YOUNG JOON Carl V. Thompson 2024-01-13T18:30:31Z 2024-01-13T18:30:31Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/109924 English electromigration Simulation stress evolution Simulations of stress evolution and the current density scaling of electromigration-induced failure times in pure and alloyed interconnects Conference 1 SRC TechCon '98 conference proceedings, Las Vegas, Nevada, Sep. 9-14, 1998, Symposium 8.4, pp.1 - 4 SRC TechCon '98 conference proceedings, Las Vegas, Nevada, Sep. 9-14, 1998, Symposium 8.4 1 4 US