정지원 Ju Byeong Kwon 이덕중 LEE YUN HI N. Y. Lee Y. W. Ko Y. G. Moon CHOI DOO JIN OH MYUNG HWAN 2024-01-13T18:31:57Z 2024-01-13T18:31:57Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/110015 English MEMS Tubeless packaging of field emission display using glass to glass electrostatic bonding technology Conference 1 Proc. IVMC '98, pp.42 - 43 Proc. IVMC '98 42 43 US