이덕중 Ju Byeong Kwon LEE YUN HI OH MYUNG HWAN LEE NAM YANG 한정인 조경익 장진 2024-01-13T18:33:15Z 2024-01-13T18:33:15Z 2021-09-29 0098-0966 https://pubs.kist.re.kr/handle/201004/110095 English MEMS Vacuum sealing of field-emission arrays using field-assisted bonding method Conference 1 Proc. SID '98, pp.589 - 592 Proc. SID '98 589 592 US