Ju Byeong Kwon 최우범 S. J. Jeong LEE NAM YANG J. I. Han K. I. Cho OH MYUNG HWAN 2024-01-13T20:34:04Z 2024-01-13T20:34:04Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/111206 English FED wafer bonding packaging New Vacuum packaging method of field emission display Conference 1 Proc. SPIE far east and pacific rim syomposium on smart materials, structures, and MEMS, Adelaide, A, v.3242, pp.? Proc. SPIE far east and pacific rim syomposium on smart materials, structures, and MEMS, Adelaide, A 3242 ? ? AT