Ju Byeong Kwon LEE YUN HI OH MYUNG HWAN 2024-01-13T21:03:48Z 2024-01-13T21:03:48Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/111445 English wafer bonding annealing elemental semiconductors etching interface structure materials testing semiconductor-insulator boundaries silicon wafer bonding Status and new evaluation method of interfacial oxide between directly-bonded Si wafer pairs Conference 1 IEEE MEMS '96, San Diego, USA., pp.337 - 342 IEEE MEMS '96, San Diego, USA. 337 342 US