I. B. Kang Ju Byeong Kwon M. R. Haskard 2024-01-13T21:30:34Z 2024-01-13T21:30:34Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/111527 English MEMS micromachining wafer bonding An assembly and interconnection technology for micromechanical structure using a anisotropic conductive film Conference 1 SPIE 1996 symp. micromachining and microfabrication, Austin, Texas., pp.? SPIE 1996 symp. micromachining and microfabrication, Austin, Texas. ? ? US