Kim Yong Tae C. S. Kwon D. J. Kim J. Y. Lee I. H. Choi 2024-01-13T22:00:49Z 2024-01-13T22:00:49Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/111809 English The properties of nitrogen implanted tungsten diffusion barrier for Cu metallization. Conference 2 Proc. of the 2nd Korea-China symp. on ion beam modification of materials and thin film materials, pp.? Proc. of the 2nd Korea-China symp. on ion beam modification of materials and thin film materials ? ? KO