Kim Yong Tae 이창우 박상규 Min Suk-Ki 2024-01-13T22:30:33Z 2024-01-13T22:30:33Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/112061 English Characteristics of amorphous tungsten nitride diffusion barrier for metal-organic chemical vapor deposited Cu metallization. Conference 1 Int'l electron devices and materials symp., pp.? Int'l electron devices and materials symp. ? ? CH