Kang, Ji-Hoon Shin, Heechang Kim, Ki Seok Song, Min-Kyu Lee, Doyoon Meng, Yuan Choi, Chanyeol Suh, Jun Min Kim, Beom Jin Kim, Hyunseok Hoang, Anh Tuan Park, Bo-In Zhou, Guanyu Sundaram, Suresh Vuong, Phuong Shin, Jiho Choe, Jinyeong Xu, Zhihao Younas, Rehan Kim, Justin S. Han, Sangmoon Lee, Sangho Kim, Sun Ok Kang, Beomseok Seo, Seungju Ahn, Hyojung Seo, Seunghwan Reidy, Kate Park, Eugene Mun, Sungchul Park, Min-Chul Lee, Suyoun Kim, Hyung-Jun Kum, Hyun S. Lin, Peng Hinkle, Christopher Ougazzaden, Abdallah Ahn, Jong-Hyun Kim, Jeehwan Bae, Sang-Hoon 2024-01-19T08:02:52Z 2024-01-19T08:02:52Z 2023-12-21 2023-12 1476-1122 https://pubs.kist.re.kr/handle/201004/113034 Three-dimensional (3D) hetero-integration technology is poised to revolutionize the field of electronics by stacking functional layers vertically, thereby creating novel 3D circuity architectures with high integration density and unparalleled multifunctionality. However, the conventional 3D integration technique involves complex wafer processing and intricate interlayer wiring. Here we demonstrate monolithic 3D integration of two-dimensional, material-based artificial intelligence (AI)-processing hardware with ultimate integrability and multifunctionality. A total of six layers of transistor and memristor arrays were vertically integrated into a 3D nanosystem to perform AI tasks, by peeling and stacking of AI processing layers made from bottom-up synthesized two-dimensional materials. This fully monolithic-3D-integrated AI system substantially reduces processing time, voltage drops, latency and footprint due to its densely packed AI processing layers with dense interlayer connectivity. The successful demonstration of this monolithic-3D-integrated AI system will not only provide a material-level solution for hetero-integration of electronics, but also pave the way for unprecedented multifunctional computing hardware with ultimate parallelism. Monolithic 3D integration of electronics based on fully 2D materials is demonstrated in the performance of artificial intelligence tasks. English Nature Publishing Group Monolithic 3D integration of 2D materials-based electronics towards ultimate edge computing solutions Article 10.1038/s41563-023-01704-z 1 Nature Materials, v.22, no.12, pp.1470 - 1477 Nature Materials 22 12 1470 1477 N scie scopus 001114078300001 2-s2.0-85178105873 Chemistry, Physical Materials Science, Multidisciplinary Physics, Applied Physics, Condensed Matter Chemistry Materials Science Physics Article SYSTEM-ON-CHIP FUTURE