Kim, SangHyeon Kim, Seong Kwang Shin, SangHoon Han, Jae-Hoom Grum, Dae-Myeong Kim, Hyung-jun Lee, Subin Kim, Han Sung Ju, Gunwu Song, Jin Dong Alam, Muhammad A. Shim, Jae-Phil 2024-01-19T10:38:07Z 2024-01-19T10:38:07Z 2022-02-28 2018-10 2573-5926 https://pubs.kist.re.kr/handle/201004/114340 English IEEE Heat Shunting by Innovative Source/Drain Contact to Enable Monolithic 3D Integration of InGaAs MOSFETs Conference 1 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) US Burlingame, CA 2018-10-15 2018 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S) 000462960700052 2-s2.0-85063152495