Kim, SangHyeon Kim, Seong-Kwang Shim, Jae-Phil Geum, Dae-myeong Ju, Gunwu Kim, Han Sung Kim, Hyung-jun Lim, Hyeong Rak Han, Jae-Hoon Kang, ChangMo Lee, Dong Seon Song, Jin Dong Choi, Won Jun LIM, HEE JEONG 2024-01-19T11:07:06Z 2024-01-19T11:07:06Z 2022-02-28 2017-10 2573-5926 https://pubs.kist.re.kr/handle/201004/114605 English IEEE Heterogeneous Integration toward Monolithic 3D Chip Conference 1 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) US Burlingame, CA 2017-10-16 2017 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S) 000463041500072