Sun, Seho Lee, Kangchun Lee, Ganggyu Kim, Yehwan Kim, Sungmin Hwang, Junha Kong, Hyungoo Chung, Kyung Yoon Ali, Ghulam Song, Taeseup Paik, Ungyu 2024-01-19T11:33:58Z 2024-01-19T11:33:58Z 2022-07-08 2022-07 1226-086X https://pubs.kist.re.kr/handle/201004/114908 Chemical mechanical planarization (CMP) is indispensable for processing of integrated circuit semiconductor devices to attain globally planarized surfaces. One of the critical consumables in the CMP process is a slurry containing abrasives like colloidal silica (SiO2). However, there is a limit to the use of CMP slurries containing SiO2 under acidic conditions due to deterioration of colloidal stability, resulting in defects on the planarized surfaces. Herein, we developed an Fe-substituted SiO2 consisting of single-atom Fe(III), enabling improved colloidal stability over universal pH regions for low-defect tungsten CMP applications. The facile and unique single-atom modification process is proposed by controlling the lattice dissolution- reprecipitation replacement of Fe3+ and Si4+ ions. The physicochemical states of Fe atoms in the surficial lattice of Fe-substituted SiO2 were confirmed through Raman spectroscopy, electron microscopy, x-ray absorption spectroscopy, and energy-dispersive x-ray spectroscopy. Consequently, enhanced performance in W CMP was achieved using Fe-substituted SiO2. Regarding defect performance, defects were reduced from 11 scratches to 0 and 94 other defects to only 7. Additionally, the removal rate increased from 67 to 122 A/min, and the surface topography improved from 6.6 to 2.9 nm. CO 2022 The Korean Society of Industrial and Engineering Chemistry. Published by Elsevier B.V. All rights reserved. English 한국공업화학회 Fe-substituted silica via lattice dissolution-reprecipitation replacement for tungsten chemical mechanical planarization Article 10.1016/j.jiec.2022.04.001 1 Journal of Industrial and Engineering Chemistry, v.111, pp.219 - 225 Journal of Industrial and Engineering Chemistry 111 219 225 N scie scopus kci 000814446600009 Chemistry, Multidisciplinary Engineering, Chemical Chemistry Engineering Article OXIDES IONS NANOPARTICLES SPECTROSCOPY ADSORPTION NUCLEATION CORROSION REMOVAL SPECTRA Silica Substitution Iron Coating pH Chemical mechanical planarization