Seok, Seonho Park, HyungDal Kim, Jinseok 2024-01-19T12:30:27Z 2024-01-19T12:30:27Z 2022-04-05 2022-04 0960-1317 https://pubs.kist.re.kr/handle/201004/115472 This paper presents a new simple method to measure thin film material properties using scotch-tape surface wrinkling. Thin metal films have been deposited on polymer substrates by e-beam evaporation. After patterned by photolithography and wet etching, long and narrow thin metal layers have been transferred by peel-off onto the scotch tape. The effect of velocity of scotch tape peel-off on the metal film transfer from polymer substrates to the scotch tape has been investigated. After metal transfer, metal film wrinkling patterns have been established on the scotch tape due to mechanical properties mismatch between the two materials. The wrinkling patterns have been characterized in term of amplitude and wavelength and they are compared with finite element method buckling simulation results for material properties extraction. By consequence, elastic moduli of 300 nm thick gold film and a multilayer of 30 nm Ti on 300 nm Au have been found 147 GPa and 885 GPa based on the measured wavelength of the wrinkling films. English Institute of Physics Publishing Scotch-tape surface wrinkling based thin-film material properties extraction Article 10.1088/1361-6439/ac542a 1 Journal of Micromechanics and Microengineering, v.32, no.4 Journal of Micromechanics and Microengineering 32 4 N scie scopus 000760508900001 2-s2.0-85126025522 Engineering, Electrical & Electronic Nanoscience & Nanotechnology Instruments & Instrumentation Physics, Applied Engineering Science & Technology - Other Topics Instruments & Instrumentation Physics Article MECHANICAL-PROPERTIES wrinkling thin film buckling material properties