Moon, J.H. Kim, S. Kim, T. Jeon, Y.S. Kim, Yang hee Ahn, Jae Pyoung Kim, Y.K. 2024-01-19T12:31:05Z 2024-01-19T12:31:05Z 2021-10-21 2022-04 1005-0302 https://pubs.kist.re.kr/handle/201004/115507 Nanoscale ruthenium (Ru)-based materials are promising replacements for existing multilayered Cu interconnects in integrated circuits. However, it is not easy to apply the results of previously reported studies directly to the electrochemical damascene process because the previous studies have mainly focused on thin films by dry deposition. Here, we report the electrical resistivity and microstructure of electrodeposited Ru nanowires. We estimate that the resistivity value of a 10 nm diameter Ru nanowire to be 71.6 μΩ cm after analyzing the resistivity values of individual nanowires with various diameters. Furthermore, we investigate the electrical properties of RuxCo1-x nanowires where x is 0.04？0.99 at.% as possible replacements of the current TaN barrier structures. Over the entire composition range, the resistivity values of alloys are much lower than that of the conventional TaN. Additionally, Ru and Ru-alloy nanowires surrounded by dielectric silica are thermally stable after 450 °C heat treatment. Therefore, the nanoscale Ru and Ru-Co alloys possessing low resistivity values can be candidates for the interconnect and barrier materials, respectively. ？ 2021 English Allerton Press Inc. Electrical resistivity evolution in electrodeposited Ru and Ru-Co nanowires Article 10.1016/j.jmst.2021.06.073 1 Journal of Materials Science & Technology, v.105, pp.17 - 25 Journal of Materials Science & Technology 105 17 25 N scie scopus 000779664200002 2-s2.0-85115259624 Materials Science, Multidisciplinary Metallurgy & Metallurgical Engineering Materials Science Metallurgy & Metallurgical Engineering Article Binary alloys Electric conductivity of solids Electrodeposition Electrodes Heat treatment Integrated circuit interconnects Nanostructured materials Nanowires Ruthenium alloys Silica Tantalum compounds Alloy nanowires Barrier material Composition ranges Cu-interconnects Damascene process Low resistivity Resistivity values Thermally stable Cobalt alloys Electrical resistivity Electrodeposition Microstructure Nanowire Ruthenium (Ru) Ruthenium-cobalt (Ru-Co)