이승혁 박태주 김성근 2024-01-19T12:33:30Z 2024-01-19T12:33:30Z 2022-04-14 2022-02 2799-8525 https://pubs.kist.re.kr/handle/201004/115644 Atomic layer deposition (ALD) is a promising technology for the uniform deposition of thin films. ALD is based on a self-limiting mechanism, which can effectively deposit thin films on the surfaces of powders of various sizes. Numerous studies are underway to improve the performance of thermoelectric materials by forming core-shell structures in which various materials are deposited on the powder surface using ALD. Thermoelectric materials are especially relevant as clean energy storage materials due to their ability to interconvert between thermal and electrical energy by the Seebeck and Peltier effects. Herein, we introduce a surface and interface modification strategy based on ALD to control the performance of thermoelectric materials. We also discuss the properties of the interface between various deposition materials and thermoelectric materials. Korean 한국분말재료학회 원자층 증착법을 이용한 열전 소재 연구 동향 Recent progress on Performance Improvements of Thermoelectric Materials using Atomic Layer Deposition Article 10.4150/KPMI.2022.29.1.56 2 한국분말재료학회지, v.29, no.1, pp.56 - 62 한국분말재료학회지 29 1 56 62 N kci ART002817577 Atomic layer deposition Thermoelectric materials Core-shell structure Coating Interface/surface modification