Kim, Jin Hyuk Chu, Sung Il Seo, Ho Won Ryu, Jae Wook Kim, Gye Tae Moon, Sung 2024-01-19T13:39:09Z 2024-01-19T13:39:09Z 2022-03-07 2007 1084-6999 https://pubs.kist.re.kr/handle/201004/116444 In this research we proposed, designed, fabricated, and measured a novel Micro Electro Mechanical System (MEMS) based vertical probe tips which differs from conventional cantilever probe tips. The main idea of the vertical probe design was how to distribute the total forces vertically concentrated on the probe tip in measuring semiconductor devices. To solve the problem, we designed the vertical probe tip with meander structure which could provide enough displacements so that the vertical probe tips could distribute the forces acting on the tips. The structural analyses of the probe tip were accomplished using finite element method (FEM) and compared with actual measurement values. The primary fabrication processes were surface micromachining, wafer bonding technology, and electroplating. The material of the electro-plated probe tip was an Ni-Co alloy. In this study, we demonstrated the potential of the vertical probe tip that could apply to a small area with the over drive (O.D.) of 10 similar to 40 mu m and the contact force of 1 similar to 8 gf. The measured contact resistance was less than 2 Q and little noise was observed. English IEEE Fabrication and characteristics of MEMS vertical type probe tip for micro sized pads measurement Conference 1 20th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2007), pp.37 - + 20th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2007) 37 + US Kobe, JAPAN 2007-01-21 PROCEEDINGS OF THE IEEE TWENTIETH ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, VOLS 1 AND 2 000255867800010 2-s2.0-42549146657 Proceedings Paper