Jee, Sung Min Ahn, Cheol-Hee Park, Jong Hyuk Kim, Tae Ann Park, Min 2024-01-19T16:01:13Z 2024-01-19T16:01:13Z 2021-09-02 2020-12 1359-8368 https://pubs.kist.re.kr/handle/201004/117697 One-component epoxy adhesives, in which the epoxy resin and curing agent are premixed, have many commercial advantages including reduced working time and stable performance. However, these adhesives suffer from a short shelf life even at room temperature. Here, core-shell structured curing agents were prepared via a dry particle coating (DPC) process that improved the storage stability of one-component epoxy adhesives. The DPC process is a simple, economic, and solvent-free method to fabricate core-shell structured materials using mechanical forces. Graphene nanoplatelets (GNPs) were used as encapsulating materials due to their high thermal conductivity and large surface areas. With the GNP-encapsulated curing agents, a one-component epoxy adhesive displayed significantly enhanced storage stability while maintaining its fast curing behavior. In particular, the pot life of the adhesive increased to 60 days, which is over two-times longer than that of a pristine epoxy adhesive. The curing temperature increased by up to 5.6 degrees C, which is a smaller increase than that observed when non-thermally conductive materials were used for encapsulation. Furthermore, the GNPs provided reinforcement in the cured epoxy adhesive, thereby improving the lap shear strength by 20-30%. English Pergamon Press Ltd. Solvent-free encapsulation of curing agents for high performing one-component epoxy adhesives Article 10.1016/j.compositesb.2020.108438 1 Composites Part B: Engineering, v.202 Composites Part B: Engineering 202 N scie scopus 000581932100040 2-s2.0-85091904984 Engineering, Multidisciplinary Materials Science, Composites Engineering Materials Science Article NANOCOMPOSITES COMPOSITES MICROENCAPSULATION STRENGTH FRACTURE Thermosetting resin Cure behavior Mechanical properties Thermal analysis