Choi, Hyun-Seok Park, Ji-Won Lee, Kyung-Sub Kim, Sang-Woo Suh, Su-Jeong 2024-01-19T16:32:07Z 2024-01-19T16:32:07Z 2021-09-02 2020-10 2073-4360 https://pubs.kist.re.kr/handle/201004/118040 This paper proposes dual-functional sheets (DFSs) that simultaneously have high thermal conductivity (TC) and electromagnetic interference (EMI) absorbing properties, making them suitable for use in mobile electronics. By adopting a simple but highly efficient dry process for manufacturing core-shell structured fillers (CSSFs) and formulating a close-packed filler composition, the DFSs show high performance, TC of 5.1 W m(-1) K-1, and a -4 dB inter-decoupling ratio (IDR) at a 1 GHz frequency. Especially, the DFSs show a high dielectric breakdown voltage (BDV) of 3 kV mm(-1), which is beneficial for application in most electronic devices. The DFSs consist of two kinds of CSSFs that are blended in accordance with the close-packing rule, Horsfield's packing model, and with polydimethylsiloxane (PDMS) polymers. The core materials are soft magnetic Fe-12.5%Cr and Fe-6.5%Si alloy powders of different sizes, and Al2O3 ceramic powders of a 1-mu m diameter are used as the shell material. The high performance of the DFS is supposed to originate from the thick and stable shell layer and the maximized filler loading capability owing to the close-packed structure. English MDPI MAGNETIC-PROPERTIES RESISTANCE NANOSHEETS PARTICLES Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core-Shell Structured Fillers and Silicone Polymers Article 10.3390/polym12102318 1 POLYMERS, v.12, no.10 POLYMERS 12 10 scie scopus 000586129700001 2-s2.0-85092765520 Polymer Science Polymer Science Article MAGNETIC-PROPERTIES RESISTANCE NANOSHEETS PARTICLES dual-functional sheet thermal conductivity inter-decoupling ratio core&#8211 shell structured fillers dielectric breakdown voltage