<?xml version="1.0" encoding="utf-8" standalone="no"?>
<dublin_core schema="dc">
<dcvalue element="contributor" qualifier="author">Kim,&#x20;Tae&#x20;Kyoung</dcvalue>
<dcvalue element="contributor" qualifier="author">Bae,&#x20;Jee&#x20;Hwan</dcvalue>
<dcvalue element="contributor" qualifier="author">Kim,&#x20;Juyoung</dcvalue>
<dcvalue element="contributor" qualifier="author">Cho,&#x20;Min&#x20;Kyung</dcvalue>
<dcvalue element="contributor" qualifier="author">Kim,&#x20;Yu-Chan</dcvalue>
<dcvalue element="contributor" qualifier="author">Jin,&#x20;Sungho</dcvalue>
<dcvalue element="contributor" qualifier="author">Chun,&#x20;Dongwon</dcvalue>
<dcvalue element="date" qualifier="accessioned">2024-01-19T17:02:04Z</dcvalue>
<dcvalue element="date" qualifier="available">2024-01-19T17:02:04Z</dcvalue>
<dcvalue element="date" qualifier="created">2021-09-02</dcvalue>
<dcvalue element="date" qualifier="issued">2020-08</dcvalue>
<dcvalue element="identifier" qualifier="issn">2072-666X</dcvalue>
<dcvalue element="identifier" qualifier="uri">https:&#x2F;&#x2F;pubs.kist.re.kr&#x2F;handle&#x2F;201004&#x2F;118316</dcvalue>
<dcvalue element="description" qualifier="abstract">Metal-assisted&#x20;chemical&#x20;etching&#x20;(MACE)&#x20;is&#x20;widely&#x20;used&#x20;to&#x20;fabricate&#x20;micro-&#x2F;nano-structured&#x20;Si&#x20;owing&#x20;to&#x20;its&#x20;simplicity&#x20;and&#x20;cost-effectiveness.&#x20;The&#x20;technique&#x20;of&#x20;magnetically&#x20;guided&#x20;MACE,&#x20;involving&#x20;MACE&#x20;with&#x20;a&#x20;tri-layer&#x20;metal&#x20;catalyst,&#x20;was&#x20;developed&#x20;to&#x20;improve&#x20;etching&#x20;speed&#x20;as&#x20;well&#x20;as&#x20;to&#x20;adjust&#x20;the&#x20;etching&#x20;direction&#x20;using&#x20;an&#x20;external&#x20;magnetic&#x20;field.&#x20;However,&#x20;the&#x20;controllability&#x20;of&#x20;the&#x20;etching&#x20;direction&#x20;diminishes&#x20;with&#x20;an&#x20;increase&#x20;in&#x20;the&#x20;etching&#x20;dimension,&#x20;owing&#x20;to&#x20;the&#x20;corrosion&#x20;of&#x20;Fe&#x20;due&#x20;to&#x20;the&#x20;etching&#x20;solution;&#x20;this&#x20;impedes&#x20;the&#x20;wider&#x20;application&#x20;of&#x20;this&#x20;approach&#x20;for&#x20;the&#x20;fabrication&#x20;of&#x20;complex&#x20;micro&#x20;Si&#x20;structures.&#x20;In&#x20;this&#x20;study,&#x20;we&#x20;modified&#x20;a&#x20;tri-layer&#x20;metal&#x20;catalyst&#x20;(Au&#x2F;Fe&#x2F;Au),&#x20;wherein&#x20;the&#x20;Fe&#x20;layer&#x20;was&#x20;encapsulated&#x20;to&#x20;improve&#x20;direction&#x20;controllability;&#x20;this&#x20;improved&#x20;controllability&#x20;was&#x20;achieved&#x20;by&#x20;protecting&#x20;Fe&#x20;against&#x20;the&#x20;corrosion&#x20;caused&#x20;by&#x20;the&#x20;etching&#x20;solution.&#x20;We&#x20;demonstrated&#x20;curved&#x20;Si&#x20;microgroove&#x20;arrays&#x20;via&#x20;magnetically&#x20;guided&#x20;MACE&#x20;with&#x20;Fe&#x20;encapsulated&#x20;in&#x20;the&#x20;tri-layer&#x20;catalyst.&#x20;Furthermore,&#x20;the&#x20;curvature&#x20;in&#x20;the&#x20;curved&#x20;Si&#x20;microarrays&#x20;could&#x20;be&#x20;modulated&#x20;via&#x20;an&#x20;external&#x20;magnetic&#x20;field,&#x20;indicating&#x20;that&#x20;direction&#x20;controllability&#x20;could&#x20;be&#x20;maintained&#x20;even&#x20;for&#x20;the&#x20;magnetically&#x20;guided&#x20;MACE&#x20;of&#x20;bulk&#x20;Si.&#x20;The&#x20;proposed&#x20;fabrication&#x20;method&#x20;developed&#x20;for&#x20;producing&#x20;curved&#x20;Si&#x20;microgroove&#x20;arrays&#x20;can&#x20;be&#x20;applied&#x20;to&#x20;electronic&#x20;devices&#x20;and&#x20;micro-electromechanical&#x20;systems.</dcvalue>
<dcvalue element="language" qualifier="none">English</dcvalue>
<dcvalue element="publisher" qualifier="none">MDPI</dcvalue>
<dcvalue element="title" qualifier="none">Curved&#x20;Structure&#x20;of&#x20;Si&#x20;by&#x20;Improving&#x20;Etching&#x20;Direction&#x20;Controllability&#x20;in&#x20;Magnetically&#x20;Guided&#x20;Metal-Assisted&#x20;Chemical&#x20;Etching</dcvalue>
<dcvalue element="type" qualifier="none">Article</dcvalue>
<dcvalue element="identifier" qualifier="doi">10.3390&#x2F;mi11080744</dcvalue>
<dcvalue element="description" qualifier="journalClass">1</dcvalue>
<dcvalue element="identifier" qualifier="bibliographicCitation">MICROMACHINES,&#x20;v.11,&#x20;no.8</dcvalue>
<dcvalue element="citation" qualifier="title">MICROMACHINES</dcvalue>
<dcvalue element="citation" qualifier="volume">11</dcvalue>
<dcvalue element="citation" qualifier="number">8</dcvalue>
<dcvalue element="description" qualifier="isOpenAccess">N</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scie</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scopus</dcvalue>
<dcvalue element="identifier" qualifier="wosid">000579708500001</dcvalue>
<dcvalue element="identifier" qualifier="scopusid">2-s2.0-85089466694</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Chemistry,&#x20;Analytical</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Nanoscience&#x20;&amp;&#x20;Nanotechnology</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Instruments&#x20;&amp;&#x20;Instrumentation</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Physics,&#x20;Applied</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Chemistry</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Science&#x20;&amp;&#x20;Technology&#x20;-&#x20;Other&#x20;Topics</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Instruments&#x20;&amp;&#x20;Instrumentation</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Physics</dcvalue>
<dcvalue element="type" qualifier="docType">Article</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">SILICON&#x20;NANOWIRES</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">ANODES</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">ARRAYS</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">magnetically&#x20;guided&#x20;metal-assisted&#x20;chemical&#x20;etching</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">bulk&#x20;Si&#x20;etching</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">curved&#x20;Si&#x20;structure</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">catalyst&#x20;encapsulation</dcvalue>
</dublin_core>
