Kim, Il Jin Lee, Ji Eun Ko, Jae Wang Jung, Jiyoon Lee, Albert S. Lee, Dong Jin Lee, Seung Geol Park, Bo-In Yu, Seunggun Lee, Jin Hong 2024-01-19T17:31:02Z 2024-01-19T17:31:02Z 2021-09-05 2020-06-01 0167-577X https://pubs.kist.re.kr/handle/201004/118536 We present a capacitive humidity sensor with molecularly engineered polyimide (PI) sensing layer. Molecularly engineered PIs were successfully prepared by synthesizing polyamic acids (PAAs) through blending of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) with 3,3',4,4'-benzophenone tetracarboxylic dianhydride (BTDA), pyromellitic dianhydride (PMDA), and 4,4-(hexafluoroisopropylidene) diphthalic anhydride (6-FDA) as monomer, followed by thermal imidization, respectively. The molecularly engineered PIs exhibited high thermal stability as well as controllable water uptake properties. Capacitive performances of the humidity sensor with PIs were efficiently increased via simple molecular blending. (C) 2020 Elsevier B.V. All rights reserved. English ELSEVIER Molecularly engineered copolyimide film for capacitive humidity sensor Article 10.1016/j.matlet.2020.127565 1 MATERIALS LETTERS, v.268 MATERIALS LETTERS 268 scie scopus 000521968300034 2-s2.0-85080082582 Materials Science, Multidisciplinary Physics, Applied Materials Science Physics Article Polyimide Capacitance Hysteresis Humidity sensor