Seok, Seonho Park, HyungDal Kim, Jinseok 2024-01-19T17:31:33Z 2024-01-19T17:31:33Z 2021-09-05 2020-06 2072-666X https://pubs.kist.re.kr/handle/201004/118562 This paper presents measurement and FEM (Finite Element Method) analysis of metal adhesion force to a parylene substrate for implantable neural probe. A test device composed of 300 nm-thick gold and 30 nm-thick titanium metal electrodes on top of parylene substrate was prepared. The metal electrodes suffer from delamination during wet metal patterning process; thus, CF(4)plasma treatment was applied to the parylene substrate before metal deposition. The two thin film metal layers were deposited by e-beam evaporation process. Metal electrodes had 200 mu m in width, 300 mu m spacing between the metal lines, and 5 mm length as the neural probe. Adhesion force of the metal lines to parylene substrate was measured with scotch tape test. Angle between the scotch tape and the test device substrate changed from 60 degrees to 90 degrees during characterization. Force exerted the scotch tape was recorded as the function of displacement of the scotch tape. It was found that a peak was created in measured force-displacement curve due to metal delamination. Metal adhesion was estimated 1.3 J/m(2)by referring to the force peak and metal width at the force-displacement curve. Besides, the scotch tape test was simulated to comprehend delamination behavior of the test through FEM modeling. English MDPI FILMS ARRAY Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural Probe Article 10.3390/mi11060605 1 MICROMACHINES, v.11, no.6 MICROMACHINES 11 6 scie scopus 000555013700001 2-s2.0-85087944109 Chemistry, Analytical Nanoscience & Nanotechnology Instruments & Instrumentation Physics, Applied Chemistry Science & Technology - Other Topics Instruments & Instrumentation Physics Article FILMS ARRAY adhesion thin film metal parylene neural probe scotch tape test FEM