Vu, Minh Canh Choi, Won-Kook Lee, Sung Goo Park, Pyeong Jun Kim, Dae Hoon Islam, Md Akhtarul Kim, Sung-Ryong 2024-01-19T17:33:02Z 2024-01-19T17:33:02Z 2022-01-25 2020-05 1944-8244 https://pubs.kist.re.kr/handle/201004/118647 Owing to the growth of demand for highly integrated electronic devices, high heat dissipation of thermal management materials is essential. Epoxy composites have been prepared with vertically aligned (VA) three-dimensional (3D)-structured SiC sheet scaffolds. The required VA-SiC sheet scaffolds were prepared by a novel approach starting with a graphene oxide (GO) scaffold. The VA-GO scaffolds were reduced to VA-graphene scaffolds in an argon environment, and the latter were subsequently transformed into VA-SiC sheet scaffolds by a template-assisted chemical vapor deposition method. Epoxy resin was filled in the empty spaces of the 3D scaffold of SiC sheets to prepare the composite mass. The material so prepared shows anisotropic thermal property with ultrahigh through-plane conductivity of 14.32 W.m(-1).K-1 at a SiC sheet content of 3.71 vol %. A thermal percolation is observed at 1.78 vol % SiC filler. The SiC sheet scaffold of covalently interconnected SiC nanoparticles plays a vital role in the formation of the thermal conductive network to significantly enhance the thermal conductivity of epoxy composites. The application of the VA-SiC/epoxy composite as an efficient thermal dissipating material has also been presented. The VA-SiC/epoxy composites have a strong potential for preparing heat-dissipating components in integrated microelectronics. English American Chemical Society High Thermal Conductivity Enhancement of Polymer Composites with Vertically Aligned Silicon Carbide Sheet Scaffolds Article 10.1021/acsami.0c02421 1 ACS Applied Materials & Interfaces, v.12, no.20, pp.23388 - 23398 ACS Applied Materials & Interfaces 12 20 23388 23398 N scie scopus 000537394100102 2-s2.0-85085264496 Nanoscience & Nanotechnology Materials Science, Multidisciplinary Science & Technology - Other Topics Materials Science Article BORON-NITRIDE RAMAN-SPECTROSCOPY SIC NANOWIRES GRAPHENE NANOCOMPOSITES INTERFACE PERFORMANCE NANOSHEETS FILLER LAYER silicon carbide sheet graphene sheet vertically aligned structure thermal conductivity thermal management