Suh, Hoyoung Heo, Mina Lee, Ji-Hyun Kim, Jin-Gyu Hong, Kimin 2024-01-19T17:33:44Z 2024-01-19T17:33:44Z 2021-09-04 2020-05 0253-2964 https://pubs.kist.re.kr/handle/201004/118687 Cu thin films were electrodeposited using electrolytes containing alkoxyliertes beta naphthol (ABN) as an organic additive, which shows a strong suppressing effect similar to PEG10000. The surface roughness of Cu thin film decreased, while the grain size remained unchanged with increasing ABN concentration. Consequently, the resistivity of Cu thin film was reduced by 41% compared to Cu thin film electrodeposited using pure electrolyte. In addition, the void free interconnect wire was fabricated by filling of 70-nm wide trench using only ABN, without the help of any accelerator or leveler. English 대한화학회 Effect of an Alkoxyliertes Beta Naphthol on Cu Electrodeposition for Application to Low-Resistivity Cu Interconnects Article 10.1002/bkcs.12003 1 Bulletin of the Korean Chemical Society, v.41, no.5, pp.530 - 536 Bulletin of the Korean Chemical Society 41 5 530 536 N scie scopus kci 000534691400006 2-s2.0-85081753478 Chemistry, Multidisciplinary Chemistry Article SUPERCONFORMAL ELECTRODEPOSITION COPPER ELECTRODEPOSITION ADDITIVES DEPOSITION BEHAVIOR ACID MODEL Copper Electrodeposition Additive Trench Resistivity