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<dublin_core schema="dc">
<dcvalue element="contributor" qualifier="author">Kook,&#x20;Geon</dcvalue>
<dcvalue element="contributor" qualifier="author">Jeong,&#x20;Sohyeon</dcvalue>
<dcvalue element="contributor" qualifier="author">Kim,&#x20;Mi&#x20;Kyung</dcvalue>
<dcvalue element="contributor" qualifier="author">Lee,&#x20;Sungwoo</dcvalue>
<dcvalue element="contributor" qualifier="author">Choi,&#x20;Nakwon</dcvalue>
<dcvalue element="contributor" qualifier="author">Lee,&#x20;Hyunjoo&#x20;J.</dcvalue>
<dcvalue element="date" qualifier="accessioned">2024-01-19T18:00:36Z</dcvalue>
<dcvalue element="date" qualifier="available">2024-01-19T18:00:36Z</dcvalue>
<dcvalue element="date" qualifier="created">2021-09-05</dcvalue>
<dcvalue element="date" qualifier="issued">2020-04</dcvalue>
<dcvalue element="identifier" qualifier="issn">2365-709X</dcvalue>
<dcvalue element="identifier" qualifier="uri">https:&#x2F;&#x2F;pubs.kist.re.kr&#x2F;handle&#x2F;201004&#x2F;118794</dcvalue>
<dcvalue element="description" qualifier="abstract">Development&#x20;of&#x20;polymeric&#x20;memristors&#x20;is&#x20;of&#x20;great&#x20;interest&#x20;for&#x20;wearable&#x20;and&#x20;implantable&#x20;applications&#x20;because&#x20;of&#x20;its&#x20;flexibility&#x20;and&#x20;transparency.&#x20;One&#x20;of&#x20;distinguished&#x20;polymeric&#x20;memristor&#x20;materials&#x20;is&#x20;silk&#x20;fibroin,&#x20;which&#x20;is&#x20;a&#x20;biodegradable&#x20;protein&#x20;extracted&#x20;from&#x20;Bombyx&#x20;mori&#x20;cocoons.&#x20;However,&#x20;fibroin&#x20;memristors&#x20;demonstrated&#x20;earlier&#x20;show&#x20;low&#x20;memory&#x20;cell&#x20;density&#x20;(&lt;100&#x20;cells&#x20;mm(-2)).&#x20;In&#x20;this&#x20;paper,&#x20;silk&#x20;fibroin&#x20;memristors&#x20;with&#x20;cell&#x20;density&#x20;25&#x20;times&#x20;higher&#x20;than&#x20;that&#x20;of&#x20;the&#x20;previously&#x20;reported&#x20;silk&#x20;fibroin&#x20;memristors&#x20;by&#x20;utilizing&#x20;wafer-scale&#x20;UV&#x20;photolithography&#x20;are&#x20;reported.&#x20;Unlike&#x20;shadow&#x20;masking&#x20;technique&#x20;adopted&#x20;in&#x20;the&#x20;previous&#x20;researches,&#x20;UV&#x20;photolithography&#x20;allows&#x20;single-micrometer-scale&#x20;alignment&#x20;between&#x20;layers&#x20;to&#x20;obtain&#x20;a&#x20;much&#x20;denser&#x20;structure.&#x20;Memristive&#x20;characteristics&#x20;of&#x20;the&#x20;silk&#x20;fibroin&#x20;memristors&#x20;are&#x20;studied&#x20;under&#x20;different&#x20;values&#x20;of&#x20;compliance&#x20;current&#x20;during&#x20;SET&#x20;process&#x20;with&#x20;different&#x20;thickness&#x20;of&#x20;silk&#x20;fibroin&#x20;films.&#x20;The&#x20;ON&#x2F;OFF&#x20;ratio&#x20;of&#x20;the&#x20;fabricated&#x20;memristors&#x20;is&#x20;maintained&#x20;over&#x20;1000&#x20;s&#x20;of&#x20;measurement,&#x20;and&#x20;remains&#x20;the&#x20;same&#x20;during&#x20;bending&#x20;over&#x20;a&#x20;cylinder&#x20;with&#x20;a&#x20;radius&#x20;of&#x20;curvature&#x20;of&#x20;1.3&#x20;mm.&#x20;It&#x20;is&#x20;shown&#x20;that&#x20;silk&#x20;fibroin&#x20;remains&#x20;biocompatible&#x20;and&#x20;biodegradable&#x20;after&#x20;undergoing&#x20;the&#x20;fabrication&#x20;process.&#x20;Demonstrated&#x20;transparency&#x20;and&#x20;lightweight&#x20;characteristics&#x20;are&#x20;desirable&#x20;for&#x20;electronic&#x20;components&#x20;for&#x20;wearable&#x20;and&#x20;implantable&#x20;systems.</dcvalue>
<dcvalue element="language" qualifier="none">English</dcvalue>
<dcvalue element="publisher" qualifier="none">WILEY</dcvalue>
<dcvalue element="subject" qualifier="none">MEMORY</dcvalue>
<dcvalue element="subject" qualifier="none">DEVICES</dcvalue>
<dcvalue element="subject" qualifier="none">ELECTRONICS</dcvalue>
<dcvalue element="subject" qualifier="none">LIGHTWEIGHT</dcvalue>
<dcvalue element="subject" qualifier="none">RESISTANCE</dcvalue>
<dcvalue element="subject" qualifier="none">MECHANISM</dcvalue>
<dcvalue element="title" qualifier="none">Fabrication&#x20;of&#x20;Highly&#x20;Dense&#x20;Silk&#x20;Fibroin&#x20;Biomemristor&#x20;Array&#x20;and&#x20;Its&#x20;Resistive&#x20;Switching&#x20;Characteristics</dcvalue>
<dcvalue element="type" qualifier="none">Article</dcvalue>
<dcvalue element="identifier" qualifier="doi">10.1002&#x2F;admt.201900991</dcvalue>
<dcvalue element="description" qualifier="journalClass">1</dcvalue>
<dcvalue element="identifier" qualifier="bibliographicCitation">ADVANCED&#x20;MATERIALS&#x20;TECHNOLOGIES,&#x20;v.5,&#x20;no.4</dcvalue>
<dcvalue element="citation" qualifier="title">ADVANCED&#x20;MATERIALS&#x20;TECHNOLOGIES</dcvalue>
<dcvalue element="citation" qualifier="volume">5</dcvalue>
<dcvalue element="citation" qualifier="number">4</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scie</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scopus</dcvalue>
<dcvalue element="identifier" qualifier="wosid">000515139700001</dcvalue>
<dcvalue element="identifier" qualifier="scopusid">2-s2.0-85083531396</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Materials&#x20;Science,&#x20;Multidisciplinary</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Materials&#x20;Science</dcvalue>
<dcvalue element="type" qualifier="docType">Article</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">MEMORY</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">DEVICES</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">ELECTRONICS</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">LIGHTWEIGHT</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">RESISTANCE</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">MECHANISM</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">biomemristors</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">fabrication</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">silk&#x20;fibroin</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">wafer-scale</dcvalue>
</dublin_core>
