Geum, Dae-Myeong Kim, Seong Kwang Kang, Chang-Mo Moon, Seung-Hyun Kyhm, Jihoon Han, JaeHoon Lee, Dong-Seon Kim, SangHyeon 2024-01-19T18:33:09Z 2024-01-19T18:33:09Z 2022-01-25 2019-12 2040-3364 https://pubs.kist.re.kr/handle/201004/119233 In this study, we proposed a strategy to fabricate vertically stacked subpixel (VSS) micro-light-emitting diodes (mu-LEDs) for future ultrahigh-resolution microdisplays. At first, to vertically stack the LED with different colors, we successfully adopted a bonding-interface-engineered monolithic integration method using SiO2/SiNx distributed Bragg reflectors (DBRs). It was found that an intermediate DBR structure could be used as the bonding layer and color filter, which could reflect and transmit desired wavelengths through the bonding interface. Furthermore, the optically pumped mu-LED array with a pitch of 0.4 mu m corresponding to the ultrahigh-resolution of 63 500 PPI could be successfully fabricated using a typical semiconductor process, including electron-beam lithography. Compared with the pick-and-place strategy (limited by machine alignment accuracy), the proposed strategy leads to the fabrication of significantly improved high-density mu-LEDs. Finally, we systematically investigated the effects of surface traps using time-resolved photoluminescence (TRPL) and two-dimensional simulations. The obtained results clearly demonstrated that performance improvements could be possible by employing optimal passivation techniques by diminishing the pixel size for fabricating low-power and highly efficient microdisplays. English ROYAL SOC CHEMISTRY Strategy toward the fabrication of ultrahigh-resolution micro-LED displays by bonding-interface-engineered vertical stacking and surface passivation Article 10.1039/c9nr04423j 1 NANOSCALE, v.11, no.48, pp.23139 - 23148 NANOSCALE 11 48 23139 23148 N scie scopus 000506883100045 2-s2.0-85076449231 Chemistry, Multidisciplinary Nanoscience & Nanotechnology Materials Science, Multidisciplinary Physics, Applied Chemistry Science & Technology - Other Topics Materials Science Physics Article LIGHT-EMITTING DIODE RECOMBINATION VELOCITY INP INTEGRATION CAVITY